Graphene sheets, an intriguing novel two-dimensional carbon material, have attracted more and more attention because of its unique properties such as high-surface area, excellent mechanical stiffness and flexibility, exceptional electrical properties, and electrochemical sensing presenting considerable potential for applications in fields such as biosensors, catalysis, electrochemical energy storage, and electronics .
Graphene-based nanomaterials exhibit many exciting properties which could be useful for fabrication of many novel devices. However, in order to fully realize these properties and applications, consistent, reliable, and inexpensive methods for growing high-quality graphene layers in excellent yields are crucial, as the existence of residual defects will heavily impact their electronic properties, despite their expected insensitivity to impurity scattering.
Various technologies were reported for the fabrication of graphene materials since the elegant “scotch tape” method, but many concerns were raised along. For example, the large-scale fabrication of graphene by chemical vapor deposition and subsequent transfer protocols make it a limiting alternative due to the special equipment and conditions used. Chemical reduction of exfoliated graphene oxide (GO) may offer the advantages of being cheap and upscalable as reported by deoxygenation of GO with various agents such as hydroquinone , NaBH4 , hydrazine hydrate , hydrazine vapor , or hydrazine with NH3 . Since these reducing agents, and in particular the hydrazine, are toxic and should be used with extreme care, green reducing agents got highly desired . On the other hand, the method of drop casting solution deposition of graphene films on a conductive substrate  presents difficulties, as well, due to bad dispersion of graphene, poor adhesion to substrate, and low reproducibility. Anyhow, it is rather difficult to derive relatively pure graphene from chemical reduction.
Therefore, developing a convenient and efficient route to produce graphene film on the conductive substrate is still a challenge. Moreover, the deposition techniques should be fully compatible with plastic substrates, low-temperature processes, and solution-processable materials, suitable for flexible substrates for large-area manufacturing technologies.